TEEIA

  • Description

  • Company Basic Information

  • Company Description

    LINCOTEC, founded in 1999, specializes in thin-film sputtering (PVD) and plasma etching equipment, with over two decades of expertise in advanced thin-film RDL and dry process technologies.

    LINCOTEC is a leading provider of SiP EMI shielding sputtering equipment and a key contributor to the global SiP supply chain for major mobile device manufacturers. Its solutions are widely adopted in applications such as 5G smartphones, wearable devices, IoT, V2X, and LEO satellite communications.

    In response to advance packaging demands, LINCOTEC has expanded its technology portfolio to Fan-Out Panel Level Packaging (FOPLP) and IC substrate applications, enabling high-density panel-level RDL and fine-line dry etching processes to support high-performance, high-reliability, and scalable manufacturing in the moving towards fine line interconnection technologies.

    Main Products and Services

    "(1) Sputtering Equipment and Technologies
    Sputtering solutions capable of achieving low resistivity, excellent film uniformity, and strong adhesion, designed for high-yield and stable mass production.
    (2) Plasma Etching Technologies and Equipment
    Focused on via and trench etching processes for fine-line applications, with strong profile control and process integration capabilities across various materials.
    (3) Advanced Packaging and Substrate Applications
    Process equipment solutions for heterogeneous integration, covering advanced packaging, panel-level packaging, and IC substrate applications.
    Process capabilities include line/space (L/S: 5/5 µm) and micro via structures (Via: 10 µm).
    (4) Dry Process Integration Technologies
    Comprehensive dry process integration, including plasma cleaning, surface activation, plasma etching, and thin film deposition.
    (5) Process Service Offering
    Providing sample testing, process development, process integration, and mass production equipment implementation.
    (6) Applications
    Semiconductor advanced packaging, IC substrates, compound semiconductors, next-generation displays, and high-power ceramic thermal management substrates.
    (7) High-Power Heat Dissipation Ceramic Substrates
    DPC/Submount ceramic substrates applicable to EEL (Edge-Emitting Laser) and VCSEL (Vertical-Cavity Surface-Emitting Laser) technologies.
    Applications include industrial lasers, ranging ICs, optical modules, and other high-power thermal management applications."

    Company Basic Information

    Company Name (Chinese)

    凌嘉科技股份有限公司

    Company Name

    LINCO TECHNOLOGY CO., LTD.

    Chairman

    陳連春

    Chairman

    Leon Chen

    Capital

    NT$833,000,000

    Capital

    NT$833,000,000

    Contact Phone

    +886-4-2460-8771

    TEL

    +886-4-2460-8771

    Fax Number

    +886-4-2460-8779

    FAX

    +886-4-2460-8779

    Address

    台中市西屯區科園一路16號

    Address

    No.16,Keyuan 1st Road, Xitun Dist., Taichung City, Taiwan

    Company Website

    http://www.lincotech.com.tw

    Website

    http://www.lincotech.com.tw

    Contact Person

    陳威全

    Contact Person

    Bill Chen

    E-mail

    bill.chen@lincotec.com

    E-mail

    bill.chen@lincotec.com

    More Vendor Recommendations

    Success!

    You have successfully subscribed to the newsletter.

    Thank you for subscribing. We will send you the latest updates.

    Back

    Success!

    You have unsubscribed from the newsletter.

    We look forward to having you subscribe again.

    Back

    Notice

    Please contact Teeia to enable your account permissions.

    Your account is temporarily disabled. Please contact our support team and we will assist you as soon as possible.

    Contact Number:
    +886-2-27293933

    Notice

    Please contact Teeia to change your password.

    If you need to change your password, please contact our support team and we will assist you as soon as possible.

    Contact Number:
    +886-2-27293933

    Rights and Interests

    Privacy Policy

    Welcome to “TEEIA Taiwan Electronic Association” (hereinafter “this website”). To help you use our services and information with peace of mind, we hereby explain our privacy policy. Please read the following carefully to protect your rights.

    I. Scope of the Privacy Policy

    This policy explains how this website handles personally identifiable information collected when you use our services. It does not apply to linked websites outside this site, nor to personnel not managed or authorized by this website.

    II. Collection, Processing, and Use of Personal Data

    • When you visit or use functions on this website, we may ask you to provide necessary personal data depending on the service. Your data will only be used within the specific stated purpose, and will not be used for other purposes without your written consent.
    • When you use interactive services such as the contact form or surveys, we retain the name, email, contact details, and time of use you provide.
    • During general browsing, the server automatically records your IP address, time of use, browser type, and pages clicked. This information is used internally to improve our services and is never disclosed externally.
    • To provide accurate services, we may analyze survey data statistically. Results may be published as aggregate statistics or descriptive text for research or public information, but will not include data identifying specific individuals.

    III. Data Protection

    • Our servers are equipped with firewalls, antivirus systems, and other security measures to protect the website and your personal data. Only authorized personnel may access your data, and they are bound by confidentiality agreements. Any breach is subject to legal penalties.
    • If we entrust third parties to provide services, they are strictly required to comply with confidentiality obligations, and we conduct necessary checks to ensure compliance.

    IV. Links to External Websites

    The privacy policy applies only to this website and how it handles personal data. It does not apply to external websites linked from this site or to personnel not managed or authorized by us.

    V. Sharing Personal Data with Third Parties

    We will never provide, exchange, rent, or sell your personal data to any other individual, organization, company, or public agency, except where required by law or contractual obligations. Exceptions include but are not limited to:

    • With your written consent.
    • When required by law.
    • To protect your life, body, freedom, or property from danger.
    • When cooperating with government agencies or academic institutions for statistics or academic research in the public interest, and the data is processed so that specific individuals cannot be identified.

    VI. Use of Cookies

    To provide the best service, this website stores and accesses cookies on your device. If you do not wish to accept cookies, you may set your browser’s privacy level to block them. However, some site functions may not work properly if cookies are disabled.

    VII. Amendments to the Privacy Policy

    This privacy policy may be revised at any time as needed. Updated terms will be posted on the website.

    • Request access to your data.
    • Request a copy.
    • Request correction or supplementation.
    • Request cessation of collection, processing, or use.
    • Request deletion.

    Modal4