廣化科技股份有限公司
3S Silicon Tech., Inc., founded in 1998 in Hsinchu, Taiwan, has around 120 employees. We have service centers in Malaysia, the Philippines, Thailand, Japan, and China for localized, responsive support.
3S is one of the few global suppliers of total power module packaging solutions, integrating process, equipment, and materials. From DOE and validation to material integration, we deliver tailored solutions. Key products include stencil printers, die bonders, clip bonders, vacuum and formic acid reflow ovens. Our formic acid system, combined with in-house no-clean solder paste, enables green, smart, AI-powered flux-free reflow.
3S’s vacuum and formic acid reflow ovens solve issues like void rates and chip oxidation. Trusted by multiple customers, they’re used in power module reflow and LEO satellites.
Our Open Lab speeds up development and ROI. 3S leads in EV packaging and is Taiwan’s only dedicated provider in this field.